Datasheet

Characteristics DVIULC6-2x6
2/17
1 Characteristics
Figure 1. Functional diagram
Table 1. Absolute ratings
Symbol Parameter Value Unit
V
PP
Peak pulse voltage
IEC61000-4-2 air discharge
IEC61000-4-2 contact discharge
MIL STD883G-Method 3015-7
±15
±15
±25
kV
T
stg
Storage temperature range -55 to +150 °C
T
j
Maximum junction temperature 125 °C
T
L
Lead solder temperature (10 seconds duration) 260 °C
Table 2. Electrical characteristics (T
amb
= 25 °C)
Symbol Parameter Test Conditions
Value
Unit
Min. Typ. Max
I
RM
Leakage current V
RM
= 5 V 0.5 µA
V
BR
Breakdown voltage between V
BUS
and GND
I
R
= 1 mA 6 V
V
CL
Clamping voltage
I
PP
= 1 A, t
p
= 8/20 µs
Any I/O pin to GND
12 V
I
PP
= 5 A, t
p
= 8/20 µs
Any I/O pin to GND
17 V
C
i/o-GND
Capacitance between I/O and GND V
R
= 0 V, F= 825 MHz 0.85 pF
ΔC
i/o-GND
Capacitance variation between I/O
and GND
V
R
= 0 V, F= 1 MHz 0.02 pF
C
i/o-i/o
Capacitance between I/O V
R
= 0 V, F= 825 MHz 0.5 pF
1
6
2
5
3
4
I/O1
I/O1
GND
V
BUS
I/O2 I/O2
1 16
2
5
3
4
I/O1 I/O1
GND V
BUS
I/O2 I/O2
µQFN 6 leads
SOT666
When used with a DVI application, Pin 5 should not be connected to
protect against backdrive current flow on data lines.