Datasheet

DSILC6-4xx Package information
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Figure 13. Flip-Chip Dimensions
Figure 16. Flip-Chip tape and reel specifications
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available
at: www.st.com.
Figure 14. Flip-Chip footprint Figure 15. Flip-Chip marking
1.1 mm ± 50 µm
1.57 mm ± 50µm
500 µm ± 50
315 µm ± 50
500 µm ± 50
650 µm ± 65
Copper pad Diameter :
220µm recommended
Solder stencil opening :
330µm recommended
Solder mask opening recommendation :
300µm recommended
x
y
x
w
z
w
E
Dot, ST logo
xx = marking
yww = datecode
(y = year
ww = week)
z = manufacturing location
Dot identifying Pin A1 location
User direction of unreeling
All dimensions in mm
4 +/- 0.1
8 +/- 0.3
4 +/- 0.1
1.75 +/- 0.1 3.5 +/- 0.1
Ø 1.5 +/- 0.1
0.73 +/- 0.05
xxz
yww
ST
E
xxz
yww
ST
E
xxz
yww
ST
E