Datasheet

Package information DALC208
12/14
6 Package information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 27. Footprint (dimensions in mm)
Table 5. SOT23-6L dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.45 0.035 0.057
A1 0 0.10 0 0.004
A2 0.90 1.30 0.035 0.051
b 0.35 0.50 0.014 0.020
c 0.09 0.20 0.004 0.008
D 2.80 3.05 0.11 0.118
E 1.50 1.75 0.059 0.069
e 0.95 0.037
H 2.60 3.00 0.102 0.118
L 0.10 0.60 0.004 0.024
θ 0° 10° 0° 10°
A2
A
L
H
c
b
E
D
e
e
A1
θ
0.95
0.60
1.20
1.10
3.50 2.30