Datasheet

CLT3-4B Package information
11/13
3 Package information
● Epoxy meets UL94,V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 13. TSSOP20 footprint (dimensions in mm)
Table 7. TSSOP20 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A1.20.047
A1 0.05 0.15 0.002 0.006
A2 0.8 1.0 1.05 0.031 0.039 0.041
b 0.19 0.3 0.007 0.012
c 0.09 0.2 0.003 0.007
D 6.4 6.5 6.6 0.252 0.256 0.259
E 6.2 6.4 6.6 0.244 0.252 0.256
E1 4.3 4.4 4.5 0.169 0.173 0.177
e 0.65 0.026
L 0.45 0.6 0.75 0.017 0.023 0.029
L1 1.0 0.039
k0° 8°0° 8°
aaa 0.1 0.004
C
E1
E
A
A2
A1
b
D
aaa
C
C
Seating
plane
0.25 mm
Gage plane
k
L
L1
11
10
20
1
PIN 1 INDENTIFICATION
e
4.93
0.65
0.36
6.21
7.26