Datasheet

Characteristics BTA24, BTB24, BTA25, BTA26, BTB26, T25
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Figure 1. Maximum power dissipation versus
RMS on-state current (full cycle)
Figure 2. RMS on-state current versus case
temperature (full cycle)
0 5 10 15 20 25
0
5
10
15
20
25
30
P(W)
I (A)
T(RMS)
I (A)
T(RMS)
0
5
10
15
20
25
30
0 25 50 75 100 125
BTA24
BTB24 / T25xx /
BTA25 / BTA26
BTB26
T (°C)
C
Figure 3. D
2
PAK RMS on-state current versus
ambient temperature (printed
circuit board FR4, copper
thickness: 35µm) (full cycle)
Figure 4. Relative variation of thermal
impedance versus pulse
duration
0 25 50 75 100 125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
I (A)
T(RMS)
T (°C)
amb
DPAK
(S=1cm )
2
2
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
1E-3
1E-2
1E-1
1E+0
K=[Z /R
th th
]
t (s)
p
Z
th(j-c)
Z
BTA / BTB24 / T25
th(j-a)
Z
BTA26
th(j-a)
Figure 5. On-state characteristics
(maximum values)
Figure 6. Surge peak on-state current
versus number of cycles
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
1
10
100
300
I (A)
TM
V (V)
TM
T = 25°C
j
.
T max.
V = 0.85V
R = 16 m
j
to
d
Ω
T=
j
T max.
j
1 10 100 1000
0
50
100
150
200
250
300
I (A)
TSM
Number of cycles
t=20ms
One cycle
Non repetitive
T initial=25°C
j
Repetitive
T =75°C
C