Datasheet

BTA/BTB12 and T12 Series
6/7
Fig. 9: Relative variation of critical rate of
decrease of main current versus junction
temperature.
Fig. 10: D²PAK Thermal resistance junction to
ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 µm).
0 25 50 75 100 125
0
1
2
3
4
5
6
Tj (°C)
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
0 4 8 1216202428323640
0
10
20
30
40
50
60
70
80
S(cm²)
Rth(j-a) (°C/W)
D²PAK
PACKAGE MECHANICAL DATA
D²PAK (Plastic)
REF.
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2 0° 8° 0° 8°
A
C2
D
R
2.0 MIN.
FLAT ZONE
A2
V2
C
A1
G
L
L3
L2
B
B2
E
FOOTPRINT DIMENSIONS (in millimeters)
D²PAK (Plastic)
8.90
3.70
1.30
5.08
16.90
10.30