Datasheet

BTA/BTB08 and T8 Series
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Fig. 1: Maximum power dissipation versus RMS
on-state current (full cycle).
Fig. 2-1: RMS on-state current versus case
temperature (full cycle).
Fig. 2-2: RMS on-state current versus ambient
temperature (printed circuit board FR4, copper
thickness: 35µm),full cycle.
Fig. 3: Relative variation of thermal impedance
versus pulse duration.
Fig. 4: On-state characteristics (maximum
values).
Fig. 5: Surge peak on-state current versus
number of cycles.
012345678
0
1
2
3
4
5
6
7
8
9
10
P (W)
IT(RMS)(A)
0 25 50 75 100 125
0
1
2
3
4
5
6
7
8
9
10
IT(RMS) (A)
BTA
BTB/T8
Tc(°C)
0 25 50 75 100 125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
IT(RMS) (A)
DPAK
(S=1cm )
2
2
Tamb(°C)
DPAK
(S=0.5cm )
2
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
1E-3
1E-2
1E-1
1E+0
K=[Zth/Rth]
Zth(j-c)
TO-220AB/D²PAK
Zth(j-a)
DPAK/IPAK
Zth(j-a)
tp(s)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
1
10
100
ITM (A)
Tj=25°C
Tj=Tj max
Tj max.
Vto = 0.85 V
Rd = 50 m
Ω
VTM(V)
1 10 100 1000
0
10
20
30
40
50
60
70
80
90
ITSM (A)
Non repetitive
Tj initial=25°C
Repetitive
Tc=100°C
One cycle
t=20ms
Number of cycles