Data Sheet

BlueNRG-M2SA
Rev 0.1 P a g e | 15 32
For more information refer to the BlueNRG-2 technical documentation
(http://www.st.com/en/wireless-connectivity/BlueNRG-2.html )
5.3 Reflow soldering
The BLUENRG-M2SA is a high temperature strength surface mount Bluetooth
®
module
supplied on a 23 pin, 4-layer PCB.
Module is assembled with special soldering paste that allow to make the additional reflow
with no changes in the module original characteristic. It’s important to respect the parameter
listed in table 6.
The final assembly recommended reflow profiles are indicated here below.
Soldering phase has to be executed with care: in order to avoid undesired melting
phenomenon, particular attention has to be taken on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on following
recommendations.
Table 6. Soldering
Profile feature PB-free assembly
Average ramp up rate (T
SMAX
to T
p
) 3°C/ sec max
Preheat
Temperature min (T
S
mn)
Temperature max (T
S
max)
Time (t
S
min to t
S
max) (t
S
)
150 °C
200 °C
60-100 sec
Time maintained above:
Temperature T
L
Time t
L
217 °C
60-70 sec
Peak temperature (T
P
) 240 + 0 °C
Time within 5 °C of actual peak temperature (T
P
) 10-20 sec
Ramp down rate 6 °C/sec
Time from 25 °C to peak temperature 8 minutes max