Datasheet

ManualsBrandsSTMICROELECTRONICS ManualsBJTs & IGBTsN/A NPN NPN

October 2007 Rev 4 1/7

Features

■ Good h

linearity

■ High f

frequency

■ Monolithic Darlington configuration with

integrated antiparallel collector-emitter diode

Application

■ Audio amplifiers

■ Linear and switching industrial equipment

Description

The devices are manufactured in planar base

island technology with monolithic Darlington

configuration.

Figure 1. Internal schematic diagram

TO-220

R1 typ.= 10 kΩ

R2 typ.= 150 Ω

Table 1. Device summary

Order code Marking Package Packaging

BDX53B BDX53B

TO-220 Tube

BDX53C BDX53C

BDX54B BDX54B

BDX54C BDX54C

BDX53B - BDX53C

BDX54B - BDX54C

Complementary power Darlington transistors

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Summary of content (7 pages)

PAGE 1
BDX53B - BDX53C BDX54B - BDX54C Complementary power Darlington transistors Features ■ Good hFE linearity ■ High fT frequency ■ Monolithic Darlington configuration with integrated antiparallel collector-emitter diode Application 3 1 ■ Audio amplifiers ■ Linear and switching industrial equipment 2 TO-220 Description The devices are manufactured in planar base island technology with monolithic Darlington configuration. Table 1. Figure 1. Internal schematic diagram R1 typ.= 10 kΩ R2 typ.
PAGE 2
Electrical ratings 1 BDX53B - BDX53C - BDX54B - BDX54C Electrical ratings Table 2. Absolute maximum ratings Value Symbol BDX53B BDX53C PNP BDX54B BDX54C Unit Collector-base voltage (IE = 0) 80 100 V VCEO Collector-emitter voltage (IB = 0) 80 100 V VEBO Emitter-base voltage (IC = 0) 5 V Collector current 8 A Collector peak current (repetitive) 12 A Base current 0.
PAGE 3
BDX53B - BDX53C - BDX54B - BDX54C 2 Electrical characteristics Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. Electrical characteristics Symbol Parameter VCEO(sus)(1) Collector-emitter sustaining voltage (IB = 0) Test conditions IC = 100 mA for BDX53B - BDX54B for BDX53C - BDX54C Min. Typ.
PAGE 4
Package mechanical data 3 BDX53B - BDX53C - BDX54B - BDX54C Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
PAGE 5
BDX53B - BDX53C - BDX54B - BDX54C Package mechanical data TO-220 mechanical data mm inch Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 ∅P Q Typ 4.40 0.61 1.14 0.49 15.25 Max Min 4.60 0.88 1.70 0.70 15.75 0.173 0.024 0.044 0.019 0.6 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 Max 0.181 0.034 0.066 0.027 0.62 0.050 16.40 28.90 3.75 2.65 Typ 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 3.
PAGE 6
Revision history 4 BDX53B - BDX53C - BDX54B - BDX54C Revision history Table 4.
PAGE 7
BDX53B - BDX53C - BDX54B - BDX54C Revision history Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.