Datasheet

Cooling method: by convection and conduction.

Marking: clear, ring at cathode end.

Weight: 0.015g

PACKAGE MECHANICAL DATA

DO 35 Glass

note 2

BA B

note 1

O/O/

REF.

DIMENSIONS

NOTES

Millimeters Inches

Min. Max. Min. Max.

3.050 4.500 0.120 0.117

1 - The lead diameter ∅ D is not controlled over zone E

2 - The minimum axial lengh within which the device may be

placed with its leads bent at right angles is 0.59”(15 mm)

12.7 0.500

∅ C

1.530 2.000 0.060 0.079

∅ D

0.458 0.558 0.018 0.022

1.27 0.050

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consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No

license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned

in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.

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