Data Sheet

Contents
1 Introduction .......................................................................2
2 Description ........................................................................3
3 Module overview ..................................................................4
3.1 Versions ......................................................................4
3.2 Power supply ..................................................................4
3.2.1 SMPS .................................................................4
3.3 Clocks........................................................................5
3.4 Antenna ......................................................................5
3.5 One time programming (OTP) ....................................................5
4 Available peripherals ..............................................................6
5 Pin description ....................................................................7
6 Recommendations................................................................10
6.1 Pin recommendations..........................................................10
6.2 Layout recommendations.......................................................11
6.2.1 STM32WB5MMG placement...............................................11
6.2.2 Enclosure effects........................................................11
6.2.3 Ground plane ..........................................................13
6.2.4 Sensitive GPIOs ........................................................13
6.2.5 Four layer reference board design ..........................................13
6.2.6 Two layer reference board design ...........................................18
7 Electrical characteristics..........................................................22
7.1 Operating conditions...........................................................22
7.2 Power consumption ...........................................................22
7.3 RF characteristics .............................................................22
7.4 Antenna radiation patterns and efficiency .........................................22
8 Thermal characteristics...........................................................24
9 Package information..............................................................25
9.1 SiP-LGA86 package information .................................................25
9.1.1 Device marking for SiP-LGA86 .............................................27
10 Ordering information .............................................................28
11 Tape and reel packing ............................................................29
12 Certification ......................................................................30
12.1 BLE(RF_PHY) certification......................................................30
12.2 CE certification ...............................................................30
STM32WB5MMG
Contents
DS13252 - Rev 3
page 37/41