Manualshelf

Data Sheet

ManualsBrandsSTMicroelectronics ManualsElectronicsChip enabling the user to communicate data through a Wireless interface
28293031323334353637
Date Revision Changes
09-Nov-2022 3
• Section 9.1.1 Device marking for SiP-LGA86
– Section 9.1 SiP-LGA86 package information
– Table 5. SiP-LGA86 - Mechanical data
• Section 9.1.1 Device marking for SiP-LGA86
– Figure 18. SiP-LGA86 marking example
• Figure 18. SiP-LGA86 marking example
• Section 8 Thermal characteristics
• Section 12 Certification
• Section 12.4 FCC certification
• Section 12.5 ISED certification
• Section 12.6 JRF certification
• Section 12.7 NCC certification
Removed: Solder reflow recommendations section
STM32WB5MMG
DS13252 - Rev 3
page 36/41