Data Sheet

Revision history
Table 7. Document revision history
Date Revision Changes
12-Nov-2020 1 Initial release.
16-Jul-2021 2
Added:
• Power supply
• SMPS
• Clocks
• Antenna
• Two layer reference board design
• BLE(RF_PHY) certification
Updated:
• Features
• Figure 1. STM32WB5MMG module block diagram
• Section 3.3 Clocks
• Section 5 Pin description
• STM32WB5MMG pin/ball definition
• Section 6.2.2 Enclosure effects
• Figure 8. Four layer reference board schematics
• Section 7.4 Antenna radiation patterns and efficiency
• Section 9.1 SiP-LGA86 package information
• Section 12 Certification
• Section 12.1 BLE(RF_PHY) certification
09-Nov-2022 3
Added:
• Section 3.1 Versions
• Section 3.5 One time programming (OTP)
• Figure 9. Four layer reference board schematics for version X
• Figure 11. Four layer PCB layout for version X
• Figure 13. Two layer reference board schematics for version X
• Figure 15. Two layer PCB layout for version X
• Section 12.3 UKCA certification
• Section 12.9 KC certification
• Section 13 Important security notice
Updated:
• Cerfication images
• Bluetooth Bluetooth
®
Low Energy protocol version support throughout the
document
• Document title
• Section Features
• Certification logo representation
• Section 1 Introduction
• Section 2 Description
• Split Section 3 Module overview into a separate section
• Section 3.1 Versions
• Figure 1. STM32WB5MMG module block diagram
• Section 3.2.1 SMPS
• Section 3.3 Clocks
• Section 5 Pin description
• Table 1. STM32WB5MMG pin/ball definition
• Section 6.1 Pin recommendations
• Section 6.2.4 Sensitive GPIOs
• Table 5. SiP-LGA86 - Mechanical data
• Figure 8. Four layer reference board schematics for version Y
• Figure 10. Four layer PCB layout for version Y
• Figure 12. Two layer reference board schematics for version Y
• Figure 14. Two layer PCB layout for version Y
STM32WB5MMG
DS13252 - Rev 3
page 35/41