Data Sheet

Table 5. SiP-LGA86 - Mechanical data
Symbol Description Min Typ Max Unit
A Total thickness 1.382±0.046 mm
A1 Pre-solder
40±20
(1)
μm
30±20
(2)
A2 - 0.150 mm
M Mold thickness 1.100
mm
S Substrate thickness 0.242
D Body length 10925 11.000 11.075
D1 Lead pitch length 7.250
D2 - 2.563
D3 - 8.438
eD Lead pitch length 0.450
E Body width 7.225 7.300 7.375
eE Lead pitch width 0.450
b1 - 0.430
b2 - 0.350
b3 - 0.300
b4 - 0.600
F1 - 0.600
F2 - 0.475
F3 - 0.900
F4 - 2.300
G1 - 0.465
G2 - 2.960
G3 - 4.800
G4 - 0.475
H1 - 0.600 mm
H2 - 0.400 mm
SP
ts
(3)
Top surface sputter 3 - 6 μm
SP
sw
(4)
Side wall sputter 1 - 3 μm
aaa Package edge tolerance 0.075
mm
bbb Mold flatness 0.100
ddd Coplanarity 0.100
1. Peripheral pads
2. Inner pads
3. Top surface sputter
4. Side wall sputter
STM32WB5MMG
SiP-LGA86 package information
DS13252 - Rev 3
page 26/41