Data Sheet

9 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
9.1 SiP-LGA86 package information
This SiP-LGA is a 86 pin, 7.3 x 11mm, system in package land grid array package.
Figure 17. SiP-LGA86 - Outline
bbb
C
ddd
C
C
B
A
aaa (4x)
SIDE VIEWBOTTOM VIEW
A
A1
DETAIL A
SP
sw
D2
S
M
SP
ts
PIN A1 CORNER
E
D3
E
eE
D
D1
eD
G2
G1
F1
F2
F3
F3
F4
G4
(x2)b1xb1
G3
A1 CORNER
(x56)b2xb3
(x24)b4xb4
F2
(x4)b2xb2
SEATING PLANE
TOP VIEW
H1
H2
A2
DETAIL A
E1
1. Drawing is not to scale.
STM32WB5MMG
Package information
DS13252 - Rev 3
page 25/41