Data Sheet

ManualsBrandsSTMicroelectronics ManualsElectronicsChip enabling the user to communicate data through a Wireless interface

Features

• Include ST state-of-the-art patented technology

• Integrated chip antenna

• Bluetooth

Low Energy 5.3, Zigbee

3.0, OpenThread certified

• Dynamic and static concurrent modes

• IEEE 802.15.4-2011 MAC PHY

• Supports 2 Mbits/s

• Frequency band 2402-2480 MHz

• Advertising extension

• Tx output power up to +6 dBm

•

Rx sensitivity: -96 dBm (Bluetooth

Low Energy at 1 Mbps), -100 dBm

(802.15.4)

• Range: up to 75 meters

•

Dedicated Arm

Cortex

-M0+ for radio and security tasks

•

Dedicated Arm

Cortex

-M4 CPU with FPU and ART (adaptative real-time

accelerator) up to 64 MHz speed

• 1-Mbyte Flash memory, 256-Kbyte SRAM

• Fully integrated BOM, including 32 MHz radio and 32 KHz RTC crystals

• Integrated SMPS

• Ultra-low-power modes for battery longevity

• 68 GPIOs

• SWD, JTAG

• Integrated IPD for best-in-class and reliable antenna matching

• 1.71 V to 3.6 V V

range

• -40 °C to 85 °C temperature range

• Built-in security features such as: secure firmware installation (SFI) for radio

stack, customer key storage/key management services, PKA, AES 256-bit,

TRNG, PCROP, CRC, 96-bit UID, possibility to derive 802.15.4 and Bluetooth

Low Energy 48-bit UEI

• Certifications: CE, FCC, IC, JRF, SRRC, RoHS, REACH, GOST, KC, NCC

• Two-layer PCB compatibility (using external raw pins only)

Application

• Lighting and home automation

• Wireless audio devices

• Wellness, healthcare, personal trackers

• Gaming and toys

• Smart locks

• Beacons and accessories

• Industrial

These pictures are not contractual

Product status link

STM32WB5MMG

Product summary

Order code STM32WB5MMG

Temperature

range

-40 °C to 85 °C

Package LGA 86L 10x10

Package

dimensions (mm)

7.3 x 11 x 1.342 x

0.435 pitch

Packaging Tape and reel

Bluetooth

Low Energy 5.3 and 802.15.4 module

STM32WB5MMG

Datasheet

DS13252 - Rev 3 - November 2022

For further information contact your local STMicroelectronics sales office.

www.st.com

Summary of content (37 pages)

PAGE 1
STM32WB5MMG Datasheet Bluetooth® Low Energy 5.3 and 802.15.4 module Features These pictures are not contractual Product status link STM32WB5MMG Product summary Order code STM32WB5MMG Temperature range -40 °C to 85 °C Package LGA 86L 10x10 Package dimensions (mm) 7.3 x 11 x 1.342 x 0.435 pitch Packaging Tape and reel • • Include ST state-of-the-art patented technology Integrated chip antenna • • • • • • • Bluetooth® Low Energy 5.3, Zigbee® 3.
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STM32WB5MMG Introduction 1 Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32WB5MMG module. This document should be read in conjunction with the Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5.3 and 802.15.4 radio solution (DS11929) and Multiprotocol wireless 32-bit MCU Arm®based Cortex®-M4 with FPU, Bluetooth® Low Energy and 802.15.4 radio solution (RM0434).
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STM32WB5MMG Description 2 Description The STM32WB5MMG is an ultra-low-power and small form factor certified 2.4 GHz wireless module. It supports Bluetooth® Low Energy 5.3, Zigbee® 3.0, OpenThread, dynamic and static concurrent modes, and 802.15.4 proprietary protocols. Based on STMicroelectronics STM32WB55VGY wireless microcontroller, the STM32WB5MMG provides best-in-class RF performance thanks to its good receiver sensitivity and a high output power signal.
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STM32WB5MMG Clocks 3.3 Clocks As the crystals are already integrated into the package, it is not possible to use any clock in bypass mode. The module integrates 32.774 kHz crystal for LSE and 32 MHz crystal for the HSE clock. • • • • 3.4 LSE must be used in medium high driving capability. (RCC_BDCR_LSEDRV[1:0] = 10, refer to Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® Low Energy and 802.15.4 radio solution (RM0434) for more details). HSE is already tuned.
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STM32WB5MMG Available peripherals 4 Available peripherals All peripherals available in STM32WB Series microcontrollers based on the WLCSP100 package are available and accessible on this module.
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STM32WB5MMG Pin description 5 Pin description The following figure shows the module pinout package bottom view. Figure 2.
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STM32WB5MMG Pin description Table 1.
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STM32WB5MMG Pin description Pin name Pin name (function after reset) Pin type J6 PB11 I/O 47 K6 PB10 I/O 48 K7 PB2 I/O 49 G4 PC4 I/O 50 J7 PA8 I/O 51 K8 PA9 I/O 52 H6 PA7 I/O 53 H7 PA6 I/O 54 K9 PA5 I/O 55 K10 PA4 I/O 56 J8 PA3 I/O STM32WB5MMG STM32WB55VGY 46 57 - VSS S 58 - ANT_IN - 59 - RF_OUT - 60 - VSS S 61 E10 PH0 I/O 62 E9 PH1 I/O 63 D8 PD14 I/O 64 B10 PE1 I/O 65 C9 PD13 I/O 66 B8 PD12 I/O 67 A8 PD7 I/O 68 A7
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STM32WB5MMG Recommendations 6 Recommendations 6.1 Pin recommendations • • • • ANT_IN and RF_OUT pins must be connected to GND. This module already integrates an antenna, so no external antenna required. The ANT_NC is only used for soldering planarity purposes. So this pin must be soldered to an unconnected pin on the customer board. PH3_BOOT0 must be tied low to enable start from flash memory. A reset pull-up is already implemented in the STM32WB Series microcontrollers.
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STM32WB5MMG Layout recommendations 6.2 Layout recommendations 6.2.1 STM32WB5MMG placement The embedded antenna manufacturer of the STM32WB5MMG recommends to place the module on the application board as shown below. Figure 4. STM32WB5MMG board placement This position allows the antenna to work to its maximum performance. If it cannot be placed as recommended above, the application board performance is be reduced. This does not, however, prevent correct operation. 6.2.
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STM32WB5MMG Layout recommendations Table 2. Minimum enclosure dimensions (mm) Note: DS13252 - Rev 3 Impact level a b c d e Impact threshold 46 60 27 23 17 High impact 13 24 3 8 5 Impact is determined by measuring the reflection losses in the appropriate direction. In case conductive material is present from other directions, the distances mentioned in Table 2 become larger. It means the same impact is observed further from module.
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STM32WB5MMG Layout recommendations 6.2.3 Ground plane Here are some recommendations with respect to the ground plane design: • • • Do not route any tracks to the right of the STM32WB5MMG and keep a large ground plane with the associated ground via. Route the tracks down directly on the top layer or with via to the other layers. The ground plane must include the presence of vias (distance between two vias = 2 mm). Figure 6. STM32WB5MMG ground plane layout Tracks Ground via Ground plane 6.2.
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STM32WB5MMG Figure 10.
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STM32WB5MMG Figure 11.
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STM32WB5MMG 6.2.6 Two layer reference board design The reference schematics are illustrated in Section 6.2.6 and the associated PCB layout is illustrated in Section 6.2.6 By using the first external pad ring, the mother board on which the module is soldered may be designed with only two layers.
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STM32WB5MMG Figure 14. Two layer PCB layout for version Y Layer 1 Layer 2 Figure 15.
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STM32WB5MMG Electrical characteristics 7 Electrical characteristics 7.1 Operating conditions Table 3. STM32WB5MMG operating conditions Parameter 7.2 Min. Typ. Max. Unit VDD 1.71 3.3 3.6 V Operating ambient temperature range -40 - 85 °C Storage temperature range -40 - 125 °C Power consumption The power consumption is identical to the regular STM32WB55. For full details refer to Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5.3 and 802.15.
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STM32WB5MMG Antenna radiation patterns and efficiency Figure 16.
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STM32WB5MMG Thermal characteristics 8 Thermal characteristics The thermal characteristics of the STM32WB5MMG are defined below and the constant values are given in Table 4 where: • ϴJA, is the junction-to-ambient thermal resistance (EIA/JESD51-2 and EIA/JESD51-6). ϴJA represents the resistance to the heat flows from the chip to ambient air. It is an indicator of package heat dissipation capability.
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STM32WB5MMG Package information 9 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 9.1 SiP-LGA86 package information This SiP-LGA is a 86 pin, 7.3 x 11mm, system in package land grid array package. Figure 17.
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STM32WB5MMG SiP-LGA86 package information Table 5. SiP-LGA86 - Mechanical data Symbol A Description Min Total thickness Typ Max 1.382±0.046 mm 40±20(1) A1 Pre-solder A2 - 0.150 M Mold thickness 1.100 S Substrate thickness 0.242 D Body length D1 Lead pitch length 7.250 D2 - 2.563 D3 - 8.438 eD Lead pitch length 0.450 μm 30±20(2) 10925 11.075 Body width eE Lead pitch width 0.450 b1 - 0.430 b2 - 0.350 b3 - 0.300 b4 - 0.600 F1 - 0.600 F2 - 0.
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STM32WB5MMG SiP-LGA86 package information 9.1.1 Device marking for SiP-LGA86 The following figure gives an example of topside marking versus pin 1 position identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below. Figure 18.
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STM32WB5MMG Ordering information 10 Ordering information Example: STM32 WB 5 M M G H 6 TR Device family STM32 = Arm-based 32-bit microcontroller Product type WB = Wireless Bluetooth® Device subfamily 5 = STM32WB55, Die 5, full set of features Pin count M = 86 pins Component type M= module Flash memory size G = 1 Mbyte Package H = LGA 86 7.
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STM32WB5MMG Tape and reel packing 11 Tape and reel packing The module tape and reel orientation and dimension are described in the figure below. Figure 19.
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STM32WB5MMG Certification 12 Certification The STM32WB5MMG module certifications status is detailed in the table below: Table 6. Certification status Certification Revision Y Revision X Bluetooth Light Energy RF-PHY X X 802.15.
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STM32WB5MMG FCC certification Figure 21. UKCA certification logo 12.4 FCC certification The STM32WB5MMG module complies with part 15 of the FCC Rules. The FCC ID is YCP-STM32WB5M001 for version Y, and YCP-32WB5MMGH02 for version X. The module label includes the corresponding FCC ID.
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STM32WB5MMG JRF certification This module contains license-exempt transmitter(s) that comply with Innovation, Science and Economic Development Canada’s license-exempt RSS(s). Operation is subject to the following two conditions: • • This module may not cause interference This module must accept any interference, including interference that may cause undesired operation of the module.
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STM32WB5MMG SRRC certification • 12.8 第十四條：低功率射頻器材之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。前述合法通信，指依電信管理法規定作業之無線電通信。低功率射頻器材須忍受合法通信或工業、科學及醫療用電波輻射性電機設備之干擾。 SRRC certification The Chinese SRRC certification is ongoing. Note: CMIIT ID is temporarily replaced with 32WBCERTIF. This code is updated with the code assigned by the China Ministry of Industry and Information Technology after SRRC certification is completed. 12.
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STM32WB5MMG Important security notice 13 Important security notice The STMicroelectronics group of companies (ST) places a high value on product security, which is why the ST product(s) identified in this documentation may be certified by various security certification bodies and/or may implement our own security measures as set forth herein. However, no level of security certification and/or built-in security measures can guarantee that ST products are resistant to all forms of attacks.
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STM32WB5MMG Revision history Table 7. Document revision history Date Revision 12-Nov-2020 1 Changes Initial release. Added: • • • • • • Power supply SMPS Clocks Antenna Two layer reference board design BLE(RF_PHY) certification Updated: 16-Jul-2021 2 • • • • • • • • • • • Features Figure 1. STM32WB5MMG module block diagram Section 3.3 Clocks Section 5 Pin description STM32WB5MMG pin/ball definition Section 6.2.2 Enclosure effects Figure 8. Four layer reference board schematics Section 7.
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STM32WB5MMG Date 09-Nov-2022 Revision 3 Changes • Section 9.1.1 Device marking for SiP-LGA86 • – Section 9.1 SiP-LGA86 package information – Table 5. SiP-LGA86 - Mechanical data Section 9.1.1 Device marking for SiP-LGA86 • • • • • • • – Figure 18. SiP-LGA86 marking example Figure 18. SiP-LGA86 marking example Section 8 Thermal characteristics Section 12 Certification Section 12.4 FCC certification Section 12.5 ISED certification Section 12.6 JRF certification Section 12.
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STM32WB5MMG Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 3 Module overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 3.
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STM32WB5MMG Contents 13 12.3 UKCA certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 12.4 FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 12.5 ISED certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 12.6 JRF certification. . . .
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STM32WB5MMG List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. STM32WB5MMG pin/ball definition . . . . Minimum enclosure dimensions (mm). . . STM32WB5MMG operating conditions . . STM32WB5MMG thermal characteristics SiP-LGA86 - Mechanical data . . . . . . . . Certification status . . . . . . . . . . . . . . . . Document revision history . . . . . . . . . . . DS13252 - Rev 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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STM32WB5MMG List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. DS13252 - Rev 3 STM32WB5MMG module block diagram . . . . . . . . . STM32WB5MMG module pinout: bottom view . . . . . Reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . STM32WB5MMG board placement . . .
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STM32WB5MMG IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment.