Datasheet

0 25 50 75 100 125 150
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
IF(av)(A)
Tamb(°C)
T
δ
=tp/T
tp
Rth(j-a)=80°C/W
Rth(j-a)=Rth(j-l)=25°C/W
Fig. 2-1: Average forward current versus ambient
temperature (δ=0.5) (1N5820/1N5821).
1E-3 1E-2 1E-1 1E+0
0
2
4
6
8
10
12
14
16
IM(A)
t(s)
Ta=100°C
Ta=75°C
Ta=25°C
I M
t
δ =0.5
Fig. 3-1: Non repetitive surge peak forward
current versus overload duration (maximum
values) (1N5820/1N5821).
1E-1 1E+0 1E+1 1E+2 1E+3
0.0
0.2
0.4
0.6
0.8
1.0
Zth(j-a)/Rth(j-a)
T
δ
=tp/T
tp
tp(s)
δ = 0.1
δ = 0.2
δ = 0.5
Single pulse
Fig. 4: Relative variation of thermal impedance
junction to ambient versus pulse duration (epoxy
printed circuit board, e(Cu)=35mm, recommended
pad layout).
0 25 50 75 100 125 150
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
IF(av)(A)
Tamb(°C)
T
δ
=tp/T
tp
Rth(j-a)=80°C/W
Rth(j-a)=Rth(j-l)=25°C/W
Fig. 2-2: Average forward current versus ambient
temperature (δ=0.5) (1N5822).
1E-3 1E-2 1E-1 1E+0
0
1
2
3
4
5
6
7
8
9
10
11
12
IM(A)
t(s)
Ta=100°C
Ta=75°C
Ta=25°C
I M
t
δ =0.5
Fig. 3-2: Non repetitive surge peak forward
current versus overload duration (maximum
values) (1N5822).
12 5102040
10
100
600
C(pF)
VR(V)
1N5822
1N5820
1N5821
F=1MHz
Tj=25°C
Fig. 5: Junction capacitance versus reverse
voltage applied (typical values).
1N582x
3/5