Datasheet

Functional description

Its low melting temperature makes the Low-Melt adhesive particularly suitable for heat-sensitive materials, such as PU foam and polystyrene. With

an application temperature of only 130°C, it protects the base surface it is applied to. The material is firm after a maximum of 80 seconds, with a

strong bond being provided after approx. 40 seconds. (Times and recommended adhesive are rough guides only).

Technical specifications

Melt temperature

130 °C

Suitable for

Paper, Card / cardboard boxes, Rubber, Rubber (CR), ABS, POM, Rigid PVC, PU foam, Polystyrene

Glue reaches final strength after:

12 h

Thermally stable

5 – 50 °C

Open time

40 s

Setting time

80 s

Solvent-free

Yes

Version

20 ea. (600 g)

PU1, net weight

0,600 kg

https://www.steinel-professional.de/

Data sheet

Accessory

Low Melt glue sticks Ø 11 mm

EAN 4007841052409

Reserve technical changes 10.2018 Page 1 from 1

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Data sheet Accessory Low Melt glue sticks Ø 11 mm EAN 4007841052409 Functional description Its low melting temperature makes the Low-Melt adhesive particularly suitable for heat-sensitive materials, such as PU foam and polystyrene. With an application temperature of only 130°C, it protects the base surface it is applied to. The material is firm after a maximum of 80 seconds, with a strong bond being provided after approx. 40 seconds. (Times and recommended adhesive are rough guides only).