Datasheet

The above values are typical and represent no form of specification. The Data Sheet serves for information purposes. Any verbal or written advise is not binding for
the company, whether such information originates from the company offices or from a sales representative. This is also in respect of any protection rights of third
parties, and does not release the customer from the responsibility of verifying the products of the company for suitability of use for the intended process or purpose.
Should any liability on the part of the company arise, the company will only indemnify for loss or damage to the same extent as for defects in quality.
TI_FG_ FluxGele_EN.doc Page 4 of 6 Issue: 28.04.06
STANNOL GmbH
Oskarstraße 3-7
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42283 Wuppertal
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Tel. [phone]
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Telefax [phone]
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E-Mail [e-mail]
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Web www.stannol.de
Wenn’s ums Löten geht
When it’s about soldering
Quand il s’agit du soudage
Wetting and spread of solder
For testing the suitability for soldering, the gel is printed onto a copper or a brass coupon.
Then a pellet of solder, 200mg, is placed onto the print. The coupon is reflowed at 300°C
on a solder bath surface. After melting the solder is spreading, and the solder spread
area gives an information on the soldering action. Besides common Sn60Pb40 alloy the
lead-free alloy Sn96Ag4 has been tested. Many trials show that under similar conditions
the spread area of the lead-free alloy is less than of a tin lead alloy.
printed placed reflowed
Examples: Spread on copper
Alloy: SnPb SnAg SnPb SnAg
Flux-Gel: Multifix 450-01 Flux-Gel 135
Examples: Spread on brass
Alloy: SnPb SnAg SnPb SnAg
Flux-Gel: Multifix 450-01 Flux-Gel 135