Datasheet

The above values are typical and represent no form of specification. The Data Sheet serves for information purposes. Any verbal or written advise is not binding for
the company, whether such information originates from the company offices or from a sales representative. This is also in respect of any protection rights of third
parties, and does not release the customer from the responsibility of verifying the products of the company for suitability of use for the intended process or purpose.
Should any liability on the part of the company arise, the company will only indemnify for loss or damage to the same extent as for defects in quality.
TI_FG_ FluxGele_EN.doc Page 2 of 6 Issue: 28.04.06
STANNOL GmbH
Oskarstraße 3-7
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42283 Wuppertal
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Tel. [phone]
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Telefax [phone]
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E-Mail [e-mail]
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Web www.stannol.de
Wenn’s ums Löten geht
When it’s about soldering
Quand il s’agit du soudage
Flux-Gels consist on following compositions: Rosin (Resin), Solvent and Activator,
which are used for a resin solution. Additionally a rheologic additive is contained to give
the right flow properties, which are typically necessary for a printing or dispensing
process. This four principal ingredients vary from type to type to adjust the gel to specific
applications.
The individual components will act in a flux gel as follows:
Component Influences to
Solvent Open time Stickiness Viscosity Residues
Resin Stickiness Viscosity Residues
Activator Wetting Residues
Rheological
Additive
Dosing and
Printing
Slump resistance
Viscosity
The basic viscosity is formed by the activated resin solution and must be stable enough
for a long time and temperature range. The choice of the solvent will influence the drying
time. Fast drying is achieved with solvents which have a high evaporation rate and
solvents with high boiling point and low evaporation rate will give a long open time of the
paste. They will be liquid over the whole soldering process. These will not dry completely
when a spot heating is applied e.g. with soldering iron. Residues will be sticky for a long
time and will dry very slowly. To avoid the problem a cleaning process is helpful. But if a
real reflow profile is applied such residues behave like in a reflow machine and they will
dry out as it is known with solder paste (products: RMA 04, Multifix 450-01, Flux-Gel
135).
If there is only local heating like it is commonly used in repair, a flux-gel with a high
vapour pressure should be used to get complete and fast drying residues (products:
Kolopaste No. 8 and for fine dispensing with a needle Smart-Gel No. 8D).
The activated resin solution need a rheologic additive, to reduce the viscosity and give a
good slump resistance for stencil printing. In a dispensing process, the shape of a dot will
remain and the drop will not spread out. A good dot definition is necessary in an
automated dispensing process. Therefore Flux-Gel 135 is the best solution.
Water soluble flux-gels are something special. They are normally highly active, and give
a good wetting of solder and a good shape of a solder joint. Effective and easy cleaning
of the flux residue with water is the advantage of this type of Flux-gel. Water is the best
and easiest no-VOC cleaning solvent. Water soluble gels require cleaning and
complete removal of flux residues. Residues contain ionic contaminants which can
lead to electromigration and corrosion.