Datasheet

TECHNICAL DATA SHEET
SOLDER FLOWTIN TC
New Lead-Free Solder Alloy for Electronic Application
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STANNOL GmbH & Co. KG • TDB_ME_FLOWTIN_TC_EN • Issue: 15.02.18 1
Haberstr. 24 • 42551 Velbert • Tel: [phone] • Fax: [phone] • E-Mail: [e-mail] • www.stannol.de
STANNOL
DESCRIPTION
Stannol Flowtin TC solders have been designed to eliminate the use of lead containing solders in electric and electronics
manufacturing.
CHARACTERISTICS
Flowtin TC offers the following advantages:
 eutectic Solder (melting point at 227°C)
 good wetting behaviour
 fine grain and smooth surface better than Ecoloy TC (S-Sn99.3Cu0.7)
 reduced dissolution of substrate metal compared with Ecoloy TC (S-Sn99.3Cu0.7)
 easy disposal – no lead containing waste
APPLICATION
Like with Ecoloy TC solder it is necessary to adjust machine settings, temperature profiles, and other parameters to the
requirements of a lead free process. But there is nothing to do when switching from Ecoloy TC to Flowtin TC, all settings and
parameters remain the same. The properties of the solder joints are at least comparable or even better than tin/lead.
The physical properties of Flowtin TC do not change compared to common tin/copper solder. But there are differences
between Ecoloy TC and Flowtin TC with micro additives.
 the solder joint solidifies as fine grain metal; therefore the surface is shinier
 the dissolution of substrate metal is reduced
 the service life of solder baths is extended due to smaller copper enrichment