User Manual

MEDER electronic
139
www.meder.com
Molded DIP
Reed Relays
Low prole package
Standard pin congurations
IC-pin compatible
4.25 kVDC breakdown voltage for pin out 13
UL approval
DESCRIPTION
DIMENSIONS
All dimensions in mm [inches]
The DIP series is a very compact design having
a low prole package and a high prole package.
This series is compatible with all DIP relays.
CHARACTERISTICS
FEATURES
High resistance option available
Diode option available
DIP Series

Summary of content (5 pages)