Datasheet

Package information Z04
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3 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
REF.
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 10.1 0.398
C7.3 0.287
D 10.5 0.413
F 1.5 0.059
H 0.51 0.020
J1.5 0.059
M4.5 0.177
N 5.3 0.209
N1 2.54 0.100
O 1.4 0.055
P 0.7 0.028
A
C
D
F
N1
N
P
O
J
M
H