Datasheet
Table Of Contents
- 1 Characteristics
- Table 1. Absolute maximum ratings
- Table 2. Electrical characteristics (Tj = 25 C, unless otherwise specified)
- Table 3. Static characteristics
- Table 4. Thermal resistances
- Figure 1. Maximum power dissipation versus on-state rms current (full cycle)
- Figure 2. On-state rms current versus lead (TO-92) or tab (SOT-223, SMBflat- 3L) temperature (full cycle)
- Figure 3. On-state rms current versus ambient temperature (free air convection full cycle)
- Figure 4. Relative variation of thermal impedance versus pulse duration (Zth(j-a))
- Figure 5. Relative variation of holding current and latching current versus junction temperature (typ. values)
- Figure 6. Relative variation of gate trigger current (IGT) and voltage (VGT) versus junction temperature
- Figure 7. Surge peak on-state current versus number of cycles
- Figure 8. Non-repetitive surge peak on-state current and corresponding value of I2t sinusoidal pulse width
- Figure 9. On-state characteristics (maximum values) (ITM = f(VTM)
- Figure 10. Relative variation of critical rate of decrease of main current versus (dV/dt)c
- Figure 11. Relative variation of critical rate of decrease of main current (dI/dt) versus junction temperature
- Figure 12. SOT-223 and SMBflat-3L thermal resistance junction to ambient versus copper surface under case
- Figure 13. Relative variation of static dV/dt immunity versus junction temperature (gate open)
- 2 Ordering information scheme
- 3 Packaging information
- 4 Ordering information
- 5 Revision history
Packaging information Z01
10/12 Doc ID 7474 Rev 10
Figure 17. Footprint and connectors for SOT-223 or SMBflat-3L (dimensions in mm)
SOT-223
SOT-223
SOT-223
SOT-223
SMBF3L
SMBF3L
SMBF3L
3.42
1.50
3.25
1.32
2.92
1.19
1.32
0.95
7.80
2.30
1.10
0.85
2.07
1.20
0.51
1.20
1.95
2.22
1.08
1.35
1.08
1.30
0.46
0.61
1.19
1.47
5.84
2.07
Solder resist
Solder lands
Solder paste
Connector line