Datasheet

X02 Characteristics
Doc ID 7480 Rev 4 3/11
Table 5. Thermal resistances
Symbol Parameter Value Unit
R
th(j-l)
Junction to leads (DC) TO-92
Max.
60
°C/W
R
th(j-t)
Junction to tab (DC) SOT-223 25
R
th(j-t)
Junction to tab (DC) SMBflat-3L 14
R
th(j-a)
Junction to ambient (DC)
TO-92 150
S = 5 cm
2
SOT-223 60
SMBflat-3L 75
Figure 1. Maximum average power
dissipation versus average
on-state current (full cycle)
Figure 2. Average and DC on-state current
versus tab (SOT-223, SMBflat-3L) or
lead (TO-92) temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
P(W)
α = 180°
I (A)
T(AV)
360°
α
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 25 50 75 100 125
D.C. (SMBflat-3L)
D.C. (TO-92)
D.C. (SOT-223)
α = 180° (SMBflat-3L)
α = 180° (SOT-223)
α = 180° (TO-92)
T or T (°C)
lead tab
I (A)
T(AV)
Figure 3. Average and DC on-state current
versus ambient temperature
Figure 4. Relative variation of thermal
impedance junction to ambient
versus pulse duration
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 25 50 75 100 125
I (A)
T(AV)
D.C. (SMBflat-3L)
D.C. (TO-92)
D.C. (SOT-223)
α = 180° (SMBflat-3L)
α = 180° (SOT-223)
α = 180° (TO-92)
T (°C)
amb
K=[Z /R
th(j-a) th(j-a)
]
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
TO-92
SOT-223
t (s)
p
SMBflat-3L