Datasheet

VNQ660SP Package and PCB thermal data
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4 Package and PCB thermal data
4.1 PowerSO-10 thermal data
Figure 25. PowerSO-10 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58mm x 58mm, PCB
thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad lay-out to 8 cm
2
).
Figure 26. R
thj-amb
Vs PCB copper area in open box free air condition
RTHjamb (ºC/W)
20
25
30
35
40
45
50
55
0246810
PCB Cu heatsink area (cm^2)