Datasheet

Package and PCB thermal data VND600SP-E
20/27 Doc ID 10876 Rev 4
4 Package and PCB thermal data
4.1 PowerSO-10 thermal data
Figure 21. PowerSO-10 PC board
(1)
1. Layout condition of R
th
and Z
th
measurements (PCB FR4 area= 58 mm x 58 mm, PCB thickness=2 mm,
Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to 8 cm
2
).
Figure 22. R
thj-amb
vs PCB copper area in open box free air condition
30
35
40
45
50
55
0246810
PCB Cu heatsink area (cm^2)
RTHj_amb (°C/W)
Tj-Tamb=50°C