Datasheet

Package and PCB thermal data VN820-E
28/44
D
oc ID 10890 Rev 8
4.3 PowerSO-10 thermal data
Figure 35. PowerSO-10 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm, PCB
thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to
8cm
2
).
Figure 36. PowerSO-10 R
thj-amb
vs PCB copper area in open box free air conditions
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