Datasheet

Package information TS922, TS922A
14/21 Doc ID 5150 Rev 8
5 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
5.1 Flip-chip package (8 bumps)
Figure 14. Top view and dimensions of 8-bump flip-chip
Figure 15. Flip-chip footprint recommendation
■ Die size: 1600 µm x 1600 µm ±30 µm
■ Die height: 350 µm ±20 µm
■ Die height (including bumps): 600 µm
■ Bumps diameter: 315 µm ±50 µm
■ Bumps height: 250 µm ±40 µm
■ Pitch: 500 µm ±10 µm
600 µm
1600 µm
1600 µm
500µm
500µm
∅ 315µm
600 µm
1600 µm
1600 µm
500µm
500µm
∅ 315µm
Pad in Cu 18μm with Flash NiAu (6μm, 0.15μm)
150μm min.
500μm
500μm
500μm
500μm
Φ=250μm
Φ=400μm
75µm min.
100μm max.
Track
Solder mask opening
TS922IJ Footprint
Pad in Cu 18μm with Flash NiAu (6μm, 0.15μm)
150μm min.
500μm
500μm
500μm
500μm
Φ=250μm
Φ=400μm
75µm min.
100μm max.
Track
Solder mask opening
Pad in Cu 18μm with Flash NiAu (6μm, 0.15μm)
150μm min.
500μm
500μm
500μm
500μm
Φ=250μm
Φ=400μm
75µm min.
100μm max.
Track
Solder mask opening
TS922IJ Footprint