Datasheet
Table Of Contents
- Figure 1. ESDAxxSC5 functional diagram
- Figure 2. ESDAxxSC6 functional diagram
- 1 Characteristics
- Table 1. Absolute ratings (Tamb = 25 C)
- Table 2. Electrical characteristics - definitions (Tamb = 25 C)
- Table 3. Electrical characteristics - values (Tamb = 25 C)
- Figure 3. Peak power dissipation versus initial junction temperature
- Figure 4. Peak pulse power versus exponential pulse duration (Tj initial = 25 C)
- Figure 5. Clamping voltage versus peak pulse current (Tj initial = 25 ˚C). Rectangular waveform tp = 2.5 µs
- Figure 6. Capacitance versus reverse applied voltage (typical values)
- Figure 7. Relative variation of leakage current versus junction temperature (typical values)
- Figure 8. Peak forward voltage drop versus peak forward current (typical values)
- 2 Application information
- 3 Technical information
- 4 Ordering information
- 5 Package information
- 6 Ordering information
- 7 Revision history
Package information ESDAxxSCx
8/11
5 Package information
● Epoxy meets UL94, V0 standard
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are Lead-free. The category of second level Interconnect
is marked on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 13. SOT23-5L footprint (dimensions in mm)
Table 4. SOT23-5L dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.45 0.035 0.057
A1 0 0.10 0 0.004
A2 0.90 1.30 0.035 0.051
b 0.35 0.50 0.014 0.020
c 0.09 0.20 0.004 0.008
D 2.80 3.05 0.11 0.118
E 1.50 1.75 0.059 0.069
e0.95 0.037
H 2.60 3.00 0.102 0.118
L 0.10 0.60 0.004 0.024
M 0° 10° 0° 10°
A2
A
L
H
c
B
E
D
e
e
A1
θ
0.95
0.60
1.20
1.10
3.50 2.30