Datasheet
Table Of Contents
- Figure 1. ESDAxxSC5 functional diagram
- Figure 2. ESDAxxSC6 functional diagram
- 1 Characteristics
- Table 1. Absolute ratings (Tamb = 25 C)
- Table 2. Electrical characteristics - definitions (Tamb = 25 C)
- Table 3. Electrical characteristics - values (Tamb = 25 C)
- Figure 3. Peak power dissipation versus initial junction temperature
- Figure 4. Peak pulse power versus exponential pulse duration (Tj initial = 25 C)
- Figure 5. Clamping voltage versus peak pulse current (Tj initial = 25 ˚C). Rectangular waveform tp = 2.5 µs
- Figure 6. Capacitance versus reverse applied voltage (typical values)
- Figure 7. Relative variation of leakage current versus junction temperature (typical values)
- Figure 8. Peak forward voltage drop versus peak forward current (typical values)
- 2 Application information
- 3 Technical information
- 4 Ordering information
- 5 Package information
- 6 Ordering information
- 7 Revision history
Characteristics ESDAxxSCx
2/11
1 Characteristics
Table 1. Absolute ratings (T
amb
= 25 °C)
Symbol Parameter Value Unit
V
PP
ESD discharge
MIL STD 883E - Method 3015-7
IEC61000-4-2 air discharge
IEC61000-4-2 contact discharge
25 kV
P
PP
Peak pulse power (8/20µs)
ESDA5V3SCx
ESDA6V1SCx
500
400
W
ESDA14V2SCx
ESDA17SC6
ESDA19SC6
ESDA25SC6
300 W
T
j
Junction temperature 150 °C
T
stg
Storage temperature range -55 to +150 °C
T
L
Maximum lead temperature for soldering during 10 s at 5mm for case 260 °C
T
op
Operating temperature range -40 to +125 °C
Table 2. Electrical characteristics - definitions (T
amb
= 25 °C)
Symbol Parameter
V
RM
Stand-off voltage
V
BR
Breakdown voltage
V
CL
Clamping voltage
I
RM
Leakage current @ V
RM
I
PP
Peak pulse current
αT Voltage temperature coefficient
C Capacitance
R
d
Dynamic resistance
V
F
Forward voltage dropt
I
I
F
V
F
V
BR
V
RM
I
PP
I
RM
V
Rd
VCL