Datasheet

STTH812 Characteristics
5/11
Figure 11. Forward recovery time versus dI
F
/dt
(typical values)
Figure 12. Junction capacitance versus
reverse voltage applied (typical
values)
Figure 13. Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board FR4, e
cu
= 35 µm)
200
300
400
500
600
700
0 100 200 300 400 500
t (ns)
fr
dI /dt(A/µs)
F
I=I
T =125°C
FF(AV)
j
V =1.5 x V max.
FR F
1
10
100
1000
1 10 100 1000
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
S (cm²)
CU
R (°C/W)
th(j-a)