Datasheet

STTH3R06
5/9
Figure 13: Thermal resistance junction to
ambient versus copper surface under lead
(epoxy FR4, e
CU
=35µm) (SMB / SMC)
Figure 14: Thermal resistance versus lead
length
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S (cm²)
CU
R (°C/W)
th(j-a)
SMB
SMC
0
10
20
30
40
50
60
70
80
90
100
5 10152025
R (°C/W)
th
L (mm)
lead
R
th(j-a)
R
th(j-l)
DO-201AD