Datasheet

Package information STTH1R04
6/10
2 Package information
● Epoxy meets UL94, V0
● Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 6. DO-41 (plastic) dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.1 5.20 0.160 0.205
B 2 2.71 0.080 0.107
C25.4 1
D 0.712 0.863 0.028 0.034
Table 7. DO-15 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 6.05 6.75 0.238 0.266
B 2.95 3.53 0.116 0.139
C 26 31 1.024 1.220
D 0.71 0.88 0.028 0.035
ØD
ØB
A
CC
D
B
A
CC