Datasheet

STTH1R04 Characteristics
5/10
Figure 11. Relative variations of dynamic
parameters versus junction
temperature
Figure 12. Transient peak forward voltage
versus dI
F
/dt (typical values)
Figure 13. Forward recovery time versus
dI
F
/dt (typical values)
Figure 14. Thermal resistance versus
lead length (DO-41)
Figure 15. Thermal resistance junction to
ambient versus lead length, DO-15
Figure 16. Thermal resistance junction to
ambient versus copper surface
under each lead, SMA, SMB, (epoxy
FR4, copper thickness = 35 µm)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
25 50 75 100 125 150
Q
RR
;I
RM
[T
j
]/Q
RR
;I
RM
[T
j
=125°C]
I
RM
Q
RR
I
F
= 1 A
V
R
=320 V
T
j
(°C)
Q
RR
;I
RM
[T
j
]/Q
RR
;I
RM
[T
j
=125°C]
0
5
10
15
20
25
30
0 50 100 150 200 250 300 350 400 450 500
V
Fp
(V)
I
F
=1 A
T
j
=125 °C
dI
F
/dt(A/µs)
0
5
10
15
20
25
30
35
40
45
50
55
0 50 100 150 200 250 300 350 400 450 500
t
FR
(ns)
I
F
=1 A
T
j
=125 °C
dI
F
/dt(A/µs)
0
20
40
60
80
100
120
5 10152025
R
th
(°C/W)
R
th(j-a)
R
th(j-l)
DO-41
L
leads
(mm)
0
20
40
60
80
100
120
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
DO-15
L
leads
(mm)
0
20
40
60
80
100
120
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
SMB
SMASMA
S
CU
(cm²)