Datasheet

STTH3R02 Ordering information scheme
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2 Ordering information scheme
Figure 11. Dynamic parameters versus
junction temperature
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead for DO-15 and
DO-201AD (Epoxy printed circuit
board FR4, e
CU
= 35µm)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
25 50 75 100 125 150
Q
RR
;I
RM
[T
j
]
/Q
RR
;I
RM
[T
j
=125°
C
]
I
RM
Q
RR
I
F
=3A
V
R
=160V
T
j
(°C)
R
th(j-a)
(°C/W)
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DO-201AD
DO-15
S
Cu
(cm²)
Figure 13. Thermal resistance versus copper
surface under each lead for SMC
(Epoxy printed circuit board FR4,
e
CU
= 35µm)
Figure 14. Thermal resistance versus lead
length for DO-201AD package
0
20
40
60
80
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
SMC
S
CU
(cm²)
0
10
20
30
40
50
60
70
80
90
100
5 10152025
R
th
(°C/W)
DO-201AD
R
th(j-a)
R
th(j-l)
L
leads
(mm)
STTH 3 R 02 XXX
Ultrafast switching diode
Average forward current
3 = 3 A
02 = 200 V
Blank = DO-201 in Ammopack
RL = DO-201 in Tape and reel
Q = DO-15 in Ammopack
QRL = DO-15 in Tape and reel
S= SMC in Tape and reel
Model R
Package
Repetitive peak reverse voltage