Datasheet

STTH3L06
4/10
Figure 7: Softness factor versus d
IF
/dt (typical
values)
Figure 8: Relative variations of dynamic
parameters versus junction temperature
Figure 9: Transient peak forward voltage
versus dI
F
/dt (typical values)
Figure 10: Forward recovery time versus dI
F
/dt
(typical values)
Figure 11: Junction capacitance versus
reverse voltage applied (typical values)
Figure 12: Thermal resistance junction to
ambient versus copper surface under lead
(epoxy FR4, e
CU
=35µm) (DO-201AD)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0 20 40 60 80 100 120 140 160 180 200
S factor
dI /dt(A/µs)
F
I=I
T =125°C
F F(AV)
j
V =400V
R
0.00
0.25
0.50
0.75
1.00
1.25
25 50 75 100 125
I
RM
Q
RR
S factor
T (°C)
j
I=I
Reference: T =125°C
FF(AV)
j
V =400V
R
V (V)
FP
0
1
2
3
4
5
6
7
8
9
10
0 20 40 60 80 100 120 140 160 180 200
dI /dt(A/µs)
F
I=I
T =125°C
F F(AV)
j
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140 160 180 200
t (ns)
fr
dI /dt(A/µs)
F
I=I
T =125°C
F F(AV)
j
V =1.1 x V max.
FR F
1
10
100
1 10 100 1000
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
0
10
20
30
40
50
60
70
80
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
DO-201AD
S (cm²)
CU