Datasheet

STTH3L06
3/10
Figure 1: Conduction losses versus average
current
Figure 2: Forward voltage drop versus forward
current
Figure 3: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
printed circuit FR4, L
leads
= 10mm, S
CU
=1cm
2
)
Figure 4: Peak reverse recovery current
versus dI
F
/dt (typical values)
Figure 5: Reverse recovery time versus dI
F
/dt
(typical values)
Figure 6: Reverse recovery charges versus dI
F
/
dt (typical values)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
P(W)
T
δ
=tp/T
tp
δ = 0.05
δ = 1
δ = 0.5
δ = 0.2
δ = 0.1
I (A)
F(AV)
0.1
1.0
10.0
100.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
I (A)
FM
V (V)
FM
T =150°C
(typical values)
j
T =25°C
(maximum values)
j
T =150°C
(maximum values)
j
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
t (s)
p
Single pulse
SMC
S = 1cm
Cu
2
DO-201AD
L = 10mm
leads
SMB
S = 1cm
Cu
2
DPAK
S = 1cm
Cu
2
0
2
4
6
8
10
12
14
16
18
20
0 50 100 150 200 250 300 350 400 450 500
I (A)
RM
dI /dt(A/µs)
F
I =2 x I
F F(AV)
I=I
FF(AV)
I =0.5 x I
F F(AV)
I =0.25 x I
FF(AV)
V =400V
T =125°C
R
j
0
100
200
300
400
500
600
700
0 20 40 60 80 100 120 140 160 180 200
t (ns)
rr
dI /dt(A/µs)
F
I =2 x I
F F(AV)
I=I
F F(AV)
I =0.5 x I
F F(AV)
V =400V
T =125°C
R
j
0
50
100
150
200
250
300
350
400
450
500
0 20 40 60 80 100 120 140 160 180 200
Q (nC)
rr
I =2 x I
FF(AV)
I =0.5 x I
FF(AV)
dI /dt(A/µs)
F
I=I
FF(AV)
V =400V
T =125°C
R
j