Datasheet

STTH1L06 Characteristics
Doc ID 8321 Rev 4 5/9
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead
(Epoxy printed circuit board FR4, copper thickness: 35 µm)
Figure 11. Transient peak forward voltage
versus dI
F
/dt (90% confidence)
Figure 12. Forward recovery time versus dI
F
/dt
(90% confidence)
0
5
10
15
20
25
0 20 40 60 80 100 120 140 160 180 200
dIF/dt(A/µs)
IF=IF(av)
Tj=125°C
VFP(V)
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140 160 180 200
dIF/dt(A/µs)
IF=IF(av)
VFR=1.1 x VF max.
Tj=125°C
tfr(ns)
Figure 13. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 14. Thermal resistance junction to
ambient versus copper surface
under each lead
1
10
100
1 10 100 1000
VR(V)
F=1MHz
Vosc=30mV
Tj=25°C
C(pF)
0
10
20
30
40
50
60
70
80
90
100
110
012345678910
S(cm²)
DO-41
Lleads=10mm
SMB
Rth(j-a)(°
C/
W)
Epoxy printed circuit board FR4, copper thickness: 35 µm
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S(cm²)
SMA
Rth(j-a)(°C/W)