Datasheet

STTH1210 Characteristics
5/11
Figure 11. Forward recovery time versus
dI
F
/dt (typical values)
Figure 12. Junction capacitance versus
reverse voltage applied (typical
values)
Figure 13. Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board FR4, e
cu
= 35 µm)
t (ns)
fr
200
300
400
500
600
700
0 100 200 300 400 500
I
F
= I
F(AV)
V
FR
= 1.5 x V
F
max.
T
j
=125°C
dI /dt(A/µs)
F
C(pF)
1
10
100
1 10 100 1000
F=1MHz
V
osc
=30mV
RMS
T
j
=25°C
V (V)
R
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
D²PAK
S (cm²)
CU