Datasheet
Electrical characteristics STTH112
4/8 Doc ID 9343 Rev 5
Figure 7. Thermal resistance junction to ambient versus copper surface under each lead
(epoxy printed circuit board FR4, copper thickness: 35µm) (SMA)
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S(cm²)
SMA








