Datasheet

Packaging information STPS8L30
4/7
2 Packaging information
Figure 9. Forward voltage drop versus
forward current
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, Cu = 35 µm) (DPAK)
I (A)
FM
V (V)
FM
T =25°C
(maximum values)
j
T =125°C
(maximum values)
j
T =150°C
(typical values)
j
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
0.1
1.0
10.0
100.0
02468101214161820
0
20
40
60
80
100
R (°C/W)
th(j-a)
S(mm²)
Table 4. DPAK dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Max Min. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2 0° 8° 0° 8°
H
L4
G
B
L2
E
B2
D
A1
R
R
C
A
C2
0.60 MIN.
V2
A2