Datasheet

ManualsBrandsST ManualsDiodesSchottky Diode, 8A, 100V, TO-220AC

April 2008 Rev 6 1/10

STPS2L30

Low drop power Schottky rectifier

Features

■ Low cost device with low drop forward voltage

for less power dissipation

■ Optimized conduction/reverse losses trade-off

which lead to the highest yield in the

applications

■ Surface mount miniature packages

■ Avalanche capability specified

Description

Single Schottky rectifier suited to switched mode

power supplies and high frequency DC to DC

converters, freewheel diode and integrated circuit

latch up protection.

Packaged in SMA and low profile SMA and SMB,

this device is especially intended for use in

parallel with MOSFETs in synchronous

rectification.

Table 1. Device summary

F(AV)

2 A

RRM

30 V

(max) 150 °C

(max) 0.375 V

SMA

STPS2L30A

SMB flat

STPS2L30UF

SMA flat

STPS2L30AF

www.st.com

Summary of content (10 pages)

PAGE 1
STPS2L30 Low drop power Schottky rectifier Features A ■ Low cost device with low drop forward voltage for less power dissipation ■ Optimized conduction/reverse losses trade-off which lead to the highest yield in the applications ■ Surface mount miniature packages ■ Avalanche capability specified K SMA STPS2L30A Description A Single Schottky rectifier suited to switched mode power supplies and high frequency DC to DC converters, freewheel diode and integrated circuit latch up protection.
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Characteristics STPS2L30 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol VRRM Parameter V 2 A TL = 130 °C δ = 0.5 Average forward current SMA TL = 120 °C δ = 0.5 SMB flat TL = 135 °C δ = 0.5 Surge non repetitive forward current tp =10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1500 W -65 to + 150 °C 150 °C Value Unit Storage temperature range Operating junction temperature (1) Tj dPtot --------------dTj < Table 3.
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STPS2L30 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 0.5) SMA IF(AV)(A) PF(AV)(W) 2.2 1.2 1.1 δ = 0.05 1.0 δ = 0.1 Rth(j-a)=Rth(j-l) δ = 0.2 δ = 0.5 SMA 2.0 1.8 0.9 1.6 0.8 δ=1 Rth(j-a)=120°C/W 1.4 0.7 1.2 0.6 1.0 0.5 0.8 0.4 0.6 0.3 T T 0.4 0.2 IF(AV)(A) 0.1 0.0 0.2 0.4 Figure 3. 0.6 0.8 1.0 1.2 1.4 0.2 δ=tp/T 0.0 1.6 1.8 2.0 0.0 2.2 2.4 2.
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Characteristics Figure 7. STPS2L30 Non repetitive surge peak forward current versus overload duration (maximum values) SMA flat Figure 8. IM(A) Normalized avalanche power derating versus pulse duration PARM(tp) PARM(1µs) 8 SMA-Flat 1 7 6 5 0.1 Ta=25 °C 4 Ta=75 °C 3 0.01 2 Ta=125 °C IM 1 t(s) t δ =0.5 0 1.E-03 1.E-02 Figure 9. tp(µs) 0.001 1.E-01 0.01 1.E+00 Normalized avalanche power derating versus junction temperature 0.1 1 10 100 1000 Figure 10.
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STPS2L30 Characteristics Figure 13. Reverse leakage current versus reverse voltage applied (typical values) Figure 14. Junction capacitance versus reverse voltage applied (typical values) IR(mA) C(pF) 1.E+02 1000 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C Tj=125°C 1.E+01 Tj=100°C 1.E+00 100 1.E-01 Tj=25°C 1.E-02 VR(V) VR(V) 10 1.E-03 0 5 10 15 20 25 Figure 15. Forward voltage drop versus forward current (high level) 10.0 1 30 10 100 Figure 16.
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Package Information 2 STPS2L30 Package Information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
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STPS2L30 Package Information Table 6. SMA flat (non exposed pad) dimensions Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.95 0.088 0.116 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 A c D L 2x L1 2x E E1 L L2 2x b L1 0.50 0.019 L2 0.50 0.019 Figure 20. SMA flat (non exposed pad) footprint dimensions 5.52 (0.217) 1.52 (0.060) 1.
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Package Information Table 7. STPS2L30 SMB flat dimensions Dimensions Ref. D L L2 E E1 L L1 b Min. A 0.90 1.10 0.035 0.043 b(1) 1.95 2.20 0.077 0.087 (1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 c 0.40 0.016 L2 0.60 0.024 Figure 21. SMB flat footprint (dimensions in mm) 5.84 2.07 8/10 3.44 Typ. L1 1. Applies to plated leads 1.20 Inches Min. Typ. Max. A c Millimeters 1.
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STPS2L30 3 Ordering information Ordering information Table 8. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS2L30A G30 SMA 0.068 g 5000 Tape and reel STPS2L30UF FG30 SMB flat 0.050 g 5000 Tape and reel STPS2L30AF F30 SMA flat 0.035 g 10000 Tape and reel Revision history Table 9. Document revision history Date Revision Changes Jul-2003 3A Aug-2004 4 SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.
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STPS2L30 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.