Datasheet

Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMC)
0
20
40
60
80
100
120
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160
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
S
Cu
(cm²)
SMC
Epoxy p rinted ci rcui t board FR4, coppe r t hickness: 35 µm
STPS4S200
Characteristics (curves)
DS10646 - Rev 4
page 5/17