Datasheet

Figure 7. Reverse leakage current versus reverse voltage
applied (typical values)
I
R
(µA)
360°
α
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 20 40 60 80 100 120 140 160 180 200
T
j
= 25 °C
T
j
= 150 °C
T
j
= 125 °C
T
j
= 100 °C
T
j
= 50 °C
T
j
= 75 °C
V
R
(V)
Figure 8. Junction capacitance versus reverse voltage
applied (typical values)
10
100
1000
1 10 100 1000
C(pF)
V
R
(V)
360°
α
F = 1 MHz
V
OSC
= 30 mV
RMS
T
j
= 25 °C
Figure 9. Forward voltage drop versus forward current
(typical values)
0.01
0.10
1.00
10.00
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
360°
α
I
F
(A)
T
j
= 125 °C
V
F
(V)
T
j
= 25 °C
Figure 10. Forward voltage drop versus forward current
(maximum values)
0.01
0.10
1.00
10.00
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
1.0
360°
α
I
F
(A)
T
j
= 125 °C
V
F
(V)
T
j
= 25 °C
Figure 11. Thermal resistance junction to ambient versus
copper surface under tab (DPAK)
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20 25 30 35 40
S
Cu
(cm²)
R
th(j-a)
(°C/W)
DPAK
Epoxy printed circuit board, copper thickness: 35 µm
Figure 12. Thermal resistance junction to ambient versus
copper surface under each lead (SMB Flat, SMB Flat
Notch)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Rth(j-a)(°C/W)
SMB flat
SMB flat Notch
S
Cu
(cm²)
Epoxy printed board FR4, copper thickness: 35 μm
STPS4S200
Characteristics (curves)
DS10646 - Rev 4
page 4/17