Datasheet

2.4 DPAK package information
• Epoxy meets UL 94,V0
• Cooling method: by conduction (C)
Figure 20. DPAK package outline
L1
L
A1
R
R
D
c
A
c2
V2
A2
H
L4
e1
e
b
L2
E
b4
Gauge
plane
0.25
D1
E1
Thermal pad
Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
STPS4S200
DPAK package information
DS10646 - Rev 4
page 13/17