STPS4S200 Datasheet 4 A - 200 V power Schottky rectifier Features • • • • • Negligible switching losses High junction temperature capability Very small conduction losses Low leakage current Tj = -40 °C minimum operating • ECOPACK2 component Applications • • • • • Inverter Lighting Battery charger Telecom power Home appliance Description Single chip Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters.
STPS4S200 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) Forward rms current 10 A 4 A 130 A IF(AV) Average forward current, δ = 0.
STPS4S200 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 3.5 PF(AV) (W) δ = 0.05 δ = 0.2 δ = 0.1 10 δ = 0.5 3.0 δ=1 2.5 Figure 2. Average forward current versus ambient temperature (δ = 0.5) I F(AV) (A) 8 DPAK Rth(j-a)=Rth(j-c) 6 2.0 1.5 4 T 1.0 0.5 δ= tp/T 0.0 0.0 0.5 1.0 1.5 2.0 2.5 I tp 3.0 3.5 F(AV) 4.0 (A) 4.5 Figure 3.
STPS4S200 Characteristics (curves) Figure 7. Reverse leakage current versus reverse voltage applied (typical values) I (µA) 1.E+04R Figure 8. Junction capacitance versus reverse voltage applied (typical values) 1000 C(pF) T = 150 °C j 1.E+03 F = 1 MHz VOSC = 30 mVRMS T = 125 °C j 1.E+02 T = 25 °C j T = 100 °C j 1.E+01 100 T = 75 °C j T = 50 °C j 1.E+00 T = 25 °C j 1.E-01 V (V) R 1.E-02 0 20 40 60 80 100 120 140 160 180 VR(V) 10 1 200 Figure 9.
STPS4S200 Characteristics (curves) Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMC) Rth(j-a) (°C/W) 160 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm 140 SMC 120 100 80 60 40 20 SCu (cm²) 0 0.0 DS10646 - Rev 4 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.
STPS4S200 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
STPS4S200 SMB Flat Notch package information 2.1 SMB Flat Notch package information • • Epoxy meets UL94, V0 Lead-free package Figure 14. SMB Flat Notch package outline A V G1 b D V1 G E E1 L1 L A1 L3 L2 c Table 4. SMB Flat Notch mechanical data Dimensions Millimeters Ref. Min. A 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.043 0.002 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.20 5.60 0.205 0.220 E1 4.05 4.60 0.159 0.
STPS4S200 SMB Flat Notch package information Figure 15. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.
STPS4S200 SMB Flat package information 2.2 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 16. SMB Flat package outline A c D L 2x L1 2 x E E1 L2 2 x b Table 5. SMB Flat mechanical data Dimensions Ref. Millimeters Min. DS10646 - Rev 4 Typ. Inches Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.
STPS4S200 SMB Flat package information Figure 17. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.
STPS4S200 SMC package information 2.3 SMC package information • Epoxy meets UL94, V0 Figure 18. SMC package outline E1 D E A1 A2 b C L E2 Table 6. SMC package mechanical data Dimensions Ref. DS10646 - Rev 4 Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 2.90 3.20 0.1142 0.1260 c 0.15 0.40 0.0059 0.0157 D 5.55 6.25 0.2185 0.2461 E 7.75 8.15 0.3051 0.3209 E1 6.60 7.15 0.2598 0.2815 E2 4.
STPS4S200 SMC package information Figure 19. SMC recommended footprint 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) 3.14 (0.124) 8.19 (0.
STPS4S200 DPAK package information 2.4 DPAK package information • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Figure 20. DPAK package outline E A b4 c2 Thermal pad E1 L2 D D1 R H L4 A1 b e e1 R c A2 L1 L 0.25 Note: DS10646 - Rev 4 V2 Gauge plane This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.
STPS4S200 DPAK package information Table 7. DPAK package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.265 E1 4.32 5.50 0.170 0.216 e 2.286 typ. 0.090 typ.
STPS4S200 Ordering Information 3 Ordering information Table 8. Ordering information DS10646 - Rev 4 Order code Marking Package Weight Base qty. Delivery mode STPS4S200B-TR S4 200B D²PAK 0.032 g 10 000 Tape and reel STPS4S200S S42 SMC 0.250 g 2500 Tape and reel STPS4S200UF FG42 SMB Flat 0.050 g 5000 Tape and reel STPS4S200UFN B42 SMB Flat Notch 0.
STPS4S200 Revision history Table 9. Document revision history DS10646 - Rev 4 Date Version Changes 17-Oct-2014 1 26-Aug-2015 2 15-May-2017 3 Updated DPAK package information and reformatted to current standard. 31-Jan-2019 4 Added Section 2.1 SMB Flat Notch package information. First release. Added device in SMC package. Updated document accordingly.
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