Datasheet

Characteristics STPS3L60
6/11 Doc ID 7505 Rev 6
Figure 15. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 16. Junction capacitance versus
reverse voltage applied
(typical values)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 5 10 15 20 25 30 35 40 45 50 55 60
Tj=125°C
Tj=25°C
Tj=100°C
V (V)
R
I (mA)
R
10
100
1000
1 10 100
F=1MHz
Vosc=30mV
Tj=25°C
V (V)
R
C(pF)
Figure 17. Forward voltage drop versus
forward current (high level)
Figure 18. Forward voltage drop versus
forward current (low level)
0
5
10
15
20
25
30
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Tj=25°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Typical values)
Tj=100°C
(Typical values)
I (A)
FM
V (V)
FM
0
1
2
3
4
5
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Tj=25°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Typical values)
Tj=100°C
(Typical values)
I (A)
FM
V (V)
FM
Figure 19. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
Figure 20. Thermal resistance junction to
ambient versus copper surface
under each lead (SMBflat)
0
20
40
60
80
100
120
0
.
00
.
5
1.
0
1.
5
2.
0
2.
53
.
03
.
5
4.
0
4.
55
.
0
SMB
S(Cu)(cm²)
R (°C/W)
th(j-a)
copper thickness = 35 µm
Expoxy printed circuit FR4,
0
20
40
60
80
100
120
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB-Flat
S(Cu)(cm²)
R (°C/W)
th(j-a)
copper thickness = 35 µm
Expoxy printed circuit FR4,