Datasheet

Figure 13. Forward voltage drop versus forward current
(low level)
0
1
2
3
4
5
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Tj=25°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Maximum values)
Tj=100°C
(Typical values)
Tj=100°C
(Typical values)
I (A)
FM
V (V)
FM
Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (SMB flat, SMB flat
Notch)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Rth(j-a)(°C/W)
SMB flat
SMB flat Notch
S
Cu
(cm²)
Epoxy printed board FR4, copper thickness: 35 μm
Figure 15. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
SMB
S
(Cu)
(cm²)
Epoxy p ri nted circuit board FR4, coppe r t hickness: 35 µm
Figure 16. Thermal resistance versus lead length (DO-15)
R (°C/W)
th
0
20
40
60
80
100
120
5 10 15 20 25
R
th(j-a)
R
th(j-I)
L (mm)
leads
Figure 17. Thermal resistance versus lead length
0
10
20
30
40
50
60
70
80
90
5 10 15 20 25
R
t
h
(
°
C/
W
)
R
th(j
-
a)
R
th(j
-
l)
DO-201AD
L
leads
(mm)
STPS3L60
Characteristics (curves)
DS2134 - Rev 7
page 6/17