Datasheet

STPS3150 Characteristics
Doc ID 9474 Rev 5 5/10
Figure 17. Thermal resistance junction to ambient versus copper surface under each lead
(epoxy printed board copper thickness = 35 µm)
Figure 13. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 14. Forward voltage drop versus
forward current
C(pF)
10
100
1000
1 10 100 1000
F=1MHz
V =30mV
T =25°C
OSC RMS
j
V (V)
R
I (A)
FM
1
10
100
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
V (V)
FM
T =25°C
(maximum values)
j
T =125°C
(typical values)
j
T =125°C
(maximum values)
j
Figure 15. Thermal resistance junction to
ambient versus copper surface
under each lead
Figure 16. Thermal resistance junction to
ambient versus copper surface
under each lead
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S (cm²)
Cu
SMB
epoxy printed board copper thickness = 35 µm
R
th
(°C/W)
0
10
20
30
40
50
60
70
80
90
5 10152025
R
th(j-I)
R
th(j-a)
L (mm)
leads
DO-201AD
epoxy printed board copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S (cm²)
CU
SMB flat
R (°C/W)
th(j-a)